Substrate type：alumina ceramics
Substrate material thickness：3mm
Conducting layer：Cu
Thickness of metal layer：100μm
Surface preparation：OSP
Metal single-sided / double sided：double sided
Copper plated through hole：no
Solder mask：no
PRODUCT FEATURES
1.the shape of the substrate is unlimited.
2.dimensional laser printed wiring.
3.no mask, fast response.
4.mature technology, no environmental pollution.
